Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending

• Main Authors: Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., Fadil, N. A.
• Format: Conference or Workshop Item
• Language: English
• Published: 2017
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/97250/1/NlMAmin2017_TinWhiskersFormationandGrowth.pdf; http://eprints.utm.my/id/eprint/97250/; http://dx.doi.org/10.1088/1757-899X/238/1/012001
• Institution: Universiti Teknologi Malaysia

Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic...