Response surface analysis of EDMed surfaces of AISI D2 steel
In this study, the effects of the machining parameters in electrical-discharge machining (EDM) on the machining characteristics of AISI D2 steel using copper electrodes were investigated. The response functions considered material removal rate (MRR) and Surface Roughness (Ra),while machining variabl...
Saved in:
Main Authors: | , |
---|---|
Format: | Article |
Published: |
2011
|
Online Access: | http://www.scopus.com/inward/record.url?eid=2-s2.0-79961038655&partnerID=40&md5=355072e476dc39e9da3781ea4c52e80b http://eprints.utp.edu.my/10067/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Universiti Teknologi Petronas |
Summary: | In this study, the effects of the machining parameters in electrical-discharge machining (EDM) on the machining characteristics of AISI D2 steel using copper electrodes were investigated. The response functions considered material removal rate (MRR) and Surface Roughness (Ra),while machining variables are pulse current, pulse on time, pause time and gap voltage. A Response surface methodology was used to reduce the total number of experiments. Empirical models correlating process variables and their interactions with the said response functions have been established. The significant parameters that critically influenced the machining characteristics were examined, and the optimal combination levels of machining parameters for material removal rate, and surface roughness were determined. The models developed reveal that pulse current is the most significant machining parameter on the response functions followed by voltage and pulse off time for MRR. However for, for Ra also pulse current is most significant followed by pulse on time and discharge voltage the respectively. The model sufficiency is very satisfactory as the coefficientR 2of is determination (R 2) is found to these be greater than 98 . These models can be used for selecting the values of process variables to get the desired. © (2011) Trans Tech Publications, Switzerland. |
---|