Finite element modeling of nano porous sintered silver material
In the packaging industry, the conventional lead-based solders have gradually become obsolete because of Hazardous Substances regulations and the rapid advancement of alternatives in microelectronics production. Sintered silver paste is proposed to bond the chips and substrates, because compared wit...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Springer Science and Business Media Deutschland GmbH
2020
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85091323214&doi=10.1007%2f978-981-15-5753-8_6&partnerID=40&md5=a939ef11e56ccceecfd0a83e2ec5ef89 http://eprints.utp.edu.my/24665/ |
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| Institution: | Universiti Teknologi Petronas |