Transition from wire formation to island formation in thermal agglomeration of a (111) silicon-on-insulator layer

The effects of Si layer thickness on thermal agglomeration of a (111) bonded silicon-on-insulator (SOI) structure were studied. As starting material, (111) bonded SOI wafers with their top Si layer thinned to 2–9 nm were used. The samples were subjected to thermal treatment at 950 °C in ultrahigh va...

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Bibliographic Details
Main Authors: Burhanudin, Zainal Arif, Nuryadi, Ratno, Ishikawa, Yasuhiko, Tabe, Michiharu
Format: Article
Published: 2006
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Online Access:http://www.sciencedirect.com/science/article/pii/S004060900501922X
http://eprints.utp.edu.my/7919/
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Institution: Universiti Teknologi Petronas