Packing and Characterizing High- power Laser Diode
p. 76-85
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oai:112.137.131.14:VNU_123-555232017-09-30T20:48:51Z Packing and Characterizing High- power Laser Diode Nguyen, Tuan Anh Didier, Decoster Au, Thi Huong Laser diode fiber – coupled die bond technology wire bond technology electro-optical conversation efficiency PVI characteristics beam quality Divergence Angle p. 76-85 In the manufacturing processes of high-power laser diode modules, the module packaging technologies play an important role; decide the efficiency of the electro-optical conversation, the beam quality and the lifetime. This paper presents the packaging of high-power laser diode modules from single chip, evaluating the electro-optical characteristics and the beam quality of the modules. The obtained results show that the packaged module has an output optical power of 5 W at current 5.9 A; the Operation Voltage is 1.7 V; the Threshold Current is 1,0 A; the Divergence Angle Mean is 36.8 degree and the Asymmetry is 1.04. These parameters are almost the same that of some on-stock modules. Thus, the application of the packaged module in social – economics is possible. 2017-08-07T03:21:23Z 2017-08-07T03:21:23Z 2016 Article 2588-1124 http://repository.vnu.edu.vn/handle/VNU_123/55523 en Vol. 32;No. 3 (2016) application/pdf H. : ĐHQGHN |
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Laser diode fiber – coupled die bond technology wire bond technology electro-optical conversation efficiency PVI characteristics beam quality Divergence Angle |
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Laser diode fiber – coupled die bond technology wire bond technology electro-optical conversation efficiency PVI characteristics beam quality Divergence Angle Nguyen, Tuan Anh Didier, Decoster Au, Thi Huong Packing and Characterizing High- power Laser Diode |
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p. 76-85 |
format |
Article |
author |
Nguyen, Tuan Anh Didier, Decoster Au, Thi Huong |
author_facet |
Nguyen, Tuan Anh Didier, Decoster Au, Thi Huong |
author_sort |
Nguyen, Tuan Anh |
title |
Packing and Characterizing High- power Laser Diode |
title_short |
Packing and Characterizing High- power Laser Diode |
title_full |
Packing and Characterizing High- power Laser Diode |
title_fullStr |
Packing and Characterizing High- power Laser Diode |
title_full_unstemmed |
Packing and Characterizing High- power Laser Diode |
title_sort |
packing and characterizing high- power laser diode |
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H. : ĐHQGHN |
publishDate |
2017 |
url |
http://repository.vnu.edu.vn/handle/VNU_123/55523 |
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1680964272881926144 |