Moran, R. L. P. (2022). Finite element analysis of active metal braised semiconductor package for warpage reduction. Animo Repository.
استشهاد بنمط شيكاغوMoran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.
MLA استشهادMoran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.