APA引文

Moran, R. L. P. (2022). Finite element analysis of active metal braised semiconductor package for warpage reduction. Animo Repository.

Chicago Style Citation

Moran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.

MLA引文

Moran, Roberto Louis P. Finite Element Analysis of Active Metal Braised Semiconductor Package for Warpage Reduction. Animo Repository, 2022.

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