أرسل هذا في رسالة قصيرة: Finite element analysis of active metal braised semiconductor package for warpage reduction

  _____    __   __   _    _     ______    _____   
 / ____||  \ \\/ // | |  | ||  /_   _//  / ____|| 
/ //---`'   \ ` //  | |/\| ||   -| ||-  / //---`' 
\ \\___      | ||   |  /\  ||   _| ||_  \ \\___   
 \_____||    |_||   |_// \_||  /_____//  \_____|| 
  `----`     `-`'   `-`   `-`  `-----`    `----`