Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement

The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices th...

Full description

Saved in:
Bibliographic Details
Main Authors: Haldos, Reymart Rio C, Abu, Patricia Angela R, Oppus, Carlos M, Reyes, Rosula SJ
Format: text
Published: Archīum Ateneo 2020
Subjects:
Online Access:https://archium.ateneo.edu/ecce-faculty-pubs/71
https://archium.ateneo.edu/cgi/viewcontent.cgi?article=1070&context=ecce-faculty-pubs
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Ateneo De Manila University
id ph-ateneo-arc.ecce-faculty-pubs-1070
record_format eprints
spelling ph-ateneo-arc.ecce-faculty-pubs-10702020-08-13T05:58:29Z Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement Haldos, Reymart Rio C Abu, Patricia Angela R Oppus, Carlos M Reyes, Rosula SJ The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices that comes with the emerging technologies translate to new processes that require new equipment that poses challenges to the industry. Thus, innovative solutions are developed by the engineers to improve and increase the production yield. This study presents the development of a monitoring system that is interfaced to an existing wirebonding machine as a means of improving production yield. The system detects and records the bouncing of the “area under bond” which is identified as a major cause of product rejection. The Arduino-based microcontroller takes the U/SG (Ultrasonic Generator/Gain) signals from the machine. The Raspberry pi monitors the real-time signal provided by the microcontroller and compares the signal from the database module with trained signals. Tests run show that the system can detect the signals and present it in a “.csv” file format. Twenty (20) units of a specific electronic device were tested to identify between good and defective device. 2020-03-01T08:00:00Z text application/pdf https://archium.ateneo.edu/ecce-faculty-pubs/71 https://archium.ateneo.edu/cgi/viewcontent.cgi?article=1070&context=ecce-faculty-pubs Electronics, Computer, and Communications Engineering Faculty Publications Archīum Ateneo Wirebond Production Yield Quality Improvement Device Under Test Electrical and Computer Engineering
institution Ateneo De Manila University
building Ateneo De Manila University Library
continent Asia
country Philippines
Philippines
content_provider Ateneo De Manila University Library
collection archium.Ateneo Institutional Repository
topic Wirebond
Production Yield
Quality Improvement
Device Under Test
Electrical and Computer Engineering
spellingShingle Wirebond
Production Yield
Quality Improvement
Device Under Test
Electrical and Computer Engineering
Haldos, Reymart Rio C
Abu, Patricia Angela R
Oppus, Carlos M
Reyes, Rosula SJ
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
description The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices that comes with the emerging technologies translate to new processes that require new equipment that poses challenges to the industry. Thus, innovative solutions are developed by the engineers to improve and increase the production yield. This study presents the development of a monitoring system that is interfaced to an existing wirebonding machine as a means of improving production yield. The system detects and records the bouncing of the “area under bond” which is identified as a major cause of product rejection. The Arduino-based microcontroller takes the U/SG (Ultrasonic Generator/Gain) signals from the machine. The Raspberry pi monitors the real-time signal provided by the microcontroller and compares the signal from the database module with trained signals. Tests run show that the system can detect the signals and present it in a “.csv” file format. Twenty (20) units of a specific electronic device were tested to identify between good and defective device.
format text
author Haldos, Reymart Rio C
Abu, Patricia Angela R
Oppus, Carlos M
Reyes, Rosula SJ
author_facet Haldos, Reymart Rio C
Abu, Patricia Angela R
Oppus, Carlos M
Reyes, Rosula SJ
author_sort Haldos, Reymart Rio C
title Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
title_short Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
title_full Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
title_fullStr Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
title_full_unstemmed Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
title_sort real-time monitoring of the semiconductor wirebond interconnection process for production yield and quality improvement
publisher Archīum Ateneo
publishDate 2020
url https://archium.ateneo.edu/ecce-faculty-pubs/71
https://archium.ateneo.edu/cgi/viewcontent.cgi?article=1070&context=ecce-faculty-pubs
_version_ 1728621358984724480