Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement
The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices th...
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2020
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ph-ateneo-arc.ecce-faculty-pubs-10702020-08-13T05:58:29Z Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement Haldos, Reymart Rio C Abu, Patricia Angela R Oppus, Carlos M Reyes, Rosula SJ The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices that comes with the emerging technologies translate to new processes that require new equipment that poses challenges to the industry. Thus, innovative solutions are developed by the engineers to improve and increase the production yield. This study presents the development of a monitoring system that is interfaced to an existing wirebonding machine as a means of improving production yield. The system detects and records the bouncing of the “area under bond” which is identified as a major cause of product rejection. The Arduino-based microcontroller takes the U/SG (Ultrasonic Generator/Gain) signals from the machine. The Raspberry pi monitors the real-time signal provided by the microcontroller and compares the signal from the database module with trained signals. Tests run show that the system can detect the signals and present it in a “.csv” file format. Twenty (20) units of a specific electronic device were tested to identify between good and defective device. 2020-03-01T08:00:00Z text application/pdf https://archium.ateneo.edu/ecce-faculty-pubs/71 https://archium.ateneo.edu/cgi/viewcontent.cgi?article=1070&context=ecce-faculty-pubs Electronics, Computer, and Communications Engineering Faculty Publications Archīum Ateneo Wirebond Production Yield Quality Improvement Device Under Test Electrical and Computer Engineering |
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Wirebond Production Yield Quality Improvement Device Under Test Electrical and Computer Engineering Haldos, Reymart Rio C Abu, Patricia Angela R Oppus, Carlos M Reyes, Rosula SJ Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
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The electronics industry in the Philippine is the largest contributor to the manufacturing sector within the country. The Philippines is also considered the fastest growing economy in the region where its electronics products are among its top exports. The manufacturing of new electronics devices that comes with the emerging technologies translate to new processes that require new equipment that poses challenges to the industry. Thus, innovative solutions are developed by the engineers to improve and increase the production yield. This study presents the development of a monitoring system that is interfaced to an existing wirebonding machine as a means of improving production yield. The system detects and records the bouncing of the “area under bond” which is identified as a major cause of product rejection. The Arduino-based microcontroller takes the U/SG (Ultrasonic Generator/Gain) signals from the machine. The Raspberry pi monitors the real-time signal provided by the microcontroller and compares the signal from the database module with trained signals. Tests run show that the system can detect the signals and present it in a “.csv” file format. Twenty (20) units of a specific electronic device were tested to identify between good and defective device. |
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text |
author |
Haldos, Reymart Rio C Abu, Patricia Angela R Oppus, Carlos M Reyes, Rosula SJ |
author_facet |
Haldos, Reymart Rio C Abu, Patricia Angela R Oppus, Carlos M Reyes, Rosula SJ |
author_sort |
Haldos, Reymart Rio C |
title |
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
title_short |
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
title_full |
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
title_fullStr |
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
title_full_unstemmed |
Real-time Monitoring of the Semiconductor Wirebond Interconnection Process for Production Yield and Quality Improvement |
title_sort |
real-time monitoring of the semiconductor wirebond interconnection process for production yield and quality improvement |
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Archīum Ateneo |
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2020 |
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https://archium.ateneo.edu/ecce-faculty-pubs/71 https://archium.ateneo.edu/cgi/viewcontent.cgi?article=1070&context=ecce-faculty-pubs |
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