Raghavan, N., Padovani, A., Li, X., Bosman, M., Wu, X., Lip Lo, V., . . . Engineering, S. o. E. a. E. (2013). Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress.
استشهاد بنمط شيكاغوRaghavan, Nagarajan, Andrea Padovani, Xiang Li, Michel Bosman, Xing Wu, Vui Lip Lo, Luca Larcher, Kin Leong Pey, و School of Electrical and Electronic Engineering. Resilience of Ultra-thin Oxynitride Films to Percolative Wear-out and Reliability Implications for High-κ Stacks At Low Voltage Stress. 2013.
MLA استشهادRaghavan, Nagarajan, et al. Resilience of Ultra-thin Oxynitride Films to Percolative Wear-out and Reliability Implications for High-κ Stacks At Low Voltage Stress. 2013.