Raghavan, N., Padovani, A., Li, X., Bosman, M., Wu, X., Lip Lo, V., . . . Engineering, S. o. E. a. E. (2013). Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress.

Raghavan, Nagarajan, Andrea Padovani, Xiang Li, Michel Bosman, Xing Wu, Vui Lip Lo, Luca Larcher, Kin Leong Pey, and School of Electrical and Electronic Engineering. Resilience of Ultra-thin Oxynitride Films to Percolative Wear-out and Reliability Implications for High-κ Stacks At Low Voltage Stress. 2013.

Raghavan, Nagarajan, et al. Resilience of Ultra-thin Oxynitride Films to Percolative Wear-out and Reliability Implications for High-κ Stacks At Low Voltage Stress. 2013.