In-situ measurement of the stiffness of the foam layer in foam-adhesive bonded structures

• Main Authors: Qin, S., Shang, H. M., Fu, Yu, Lam, Yee Cheong
• Other Authors: International Conference on Experimental Mechanics : Advances and Applications (1997 : Singapore)
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Aeronautical engineering::Materials of construction
• Online Access: https://hdl.handle.net/10356/101391; http://hdl.handle.net/10220/6478
• Institution: Nanyang Technological University

Foam-adhesive bonding is a common fabrication process in the aerospace, the automobile and the electronic industry. During service, the change with time in the behavior of components fabricated by this process is often caused by degradation of the foam layer within. As it is impractical, and at time...