Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

• Main Authors: Wang, Jun Jun, Zhang, Yue Ping, Chua, Kai Meng, Lu, Albert Chee Wai
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/102225; http://hdl.handle.net/10220/4649
• Institution: Nanyang Technological University

This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal t...