Customized glass sealant for ceramic substrates for high temperature electronic application

• Main Authors: Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/102501; http://hdl.handle.net/10220/24287
• Institution: Nanyang Technological University

This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250 °C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.