Efficient analysis of radiated immunity of printed circuit boards using SPICE

• Main Authors: Zhao, Huapeng, Gao, Xianke, Wang, Binfang, Li, Erping, Chua, Eng Kee
• Other Authors: IEEE International Symposium on Electromagnetic Compatibility (2012 : Pittsburgh, Pennsylvania, US)
• Format: Conference or Workshop Item
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/102546; http://hdl.handle.net/10220/16377
• Institution: Nanyang Technological University

This paper proposes an efficient method for simulating the radiated immunity of printed circuit board (PCB) with arbitrarily oriented traces. Existing methods usually deal with plane wave excited PCB with simple configuration, for which a SPICE model can be analytically derived. Nevertheless, it is...