Highly efficient compact size 0.7W broad bandwidth power amplifier

In this paper, we present a highly efficient compact size three stage distributed power amplifier (DPA) for high power broad bandwidth applications. The DPA is fabricated using InGaP/GaAs hetero-junction bipolar transistor (HBT) technology. The design trade-off between power, efficiency and terminal...

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書目詳細資料
Main Authors: Thein, Than Tun, Law, Choi Look, Fu, Kai, Aung, A.
其他作者: School of Electrical and Electronic Engineering
格式: Conference or Workshop Item
語言:English
出版: 2013
主題:
在線閱讀:https://hdl.handle.net/10356/102825
http://hdl.handle.net/10220/16880
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總結:In this paper, we present a highly efficient compact size three stage distributed power amplifier (DPA) for high power broad bandwidth applications. The DPA is fabricated using InGaP/GaAs hetero-junction bipolar transistor (HBT) technology. The design trade-off between power, efficiency and terminal matching is discussed. Reactive termination is used at the idle port of input and output transmission lines to improve efficiency. By compromising matching, the chip size is optimized to 1.8 mm2. Output power at 1dB gain compression (P1dB) is 30.5dBm at 3.5GHz and averages output power is around 28.5dBm across the (2.5 to 6) GHz band. The associated maximum and average Power Added Efficiency (PAE) at P1dB are 43% and 33%, respectively. Average large signal gain is 7 dB across the band. Small signal simulation results agree well with the measurements results.