Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters

• Main Authors: Lim, Adeline B. Y., Chang, Andrew C. K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/102892; http://hdl.handle.net/10220/24289
• Institution: Nanyang Technological University

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) w...