Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters

• المؤلفون الرئيسيون: Lim, Adeline B. Y., Chang, Andrew C. K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/102892; http://hdl.handle.net/10220/24289

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) w...