Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters

• Main Authors: Lim, Adeline B. Y., Chang, Andrew C. K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong
• 其他作者: School of Materials Science & Engineering
• 格式: Article
• 語言: English
• 出版: 2014
• 主題: DRNTU::Engineering::Materials::Electronic packaging materials
• 在線閱讀: https://hdl.handle.net/10356/102892; http://hdl.handle.net/10220/24289
• 機構: Nanyang Technological University

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) w...