A universal, rapid method for clean transfer of nanostructures onto various substrates
Transfer and integration of nanostructures onto target substrates is the prerequisite for their fundamental studies and practical applications. Conventional transfer techniques that involve stamping, lift-off, and/or striping suffer from the process-specific drawbacks, such as the requirement for ch...
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Main Authors: | , , , , , |
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其他作者: | |
格式: | Article |
語言: | English |
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2014
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主題: | |
在線閱讀: | https://hdl.handle.net/10356/103150 http://hdl.handle.net/10220/24425 |
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機構: | Nanyang Technological University |
語言: | English |