Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles
Etched hollow glass bubbles (HGBs) with through-holes at micron level were used as micro-containers for epoxy and amine solution to realize the self-healing functionality in epoxy matrix. The average diameter, the average shell thickness, as well as the cavity inside the shell were investigated. In...
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sg-ntu-dr.10356-1045952023-03-04T17:14:56Z Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles Zhang, He Wang, Pengfei Yang, Jinglei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Aeronautical engineering::Aerodynamics Etched hollow glass bubbles (HGBs) with through-holes at micron level were used as micro-containers for epoxy and amine solution to realize the self-healing functionality in epoxy matrix. The average diameter, the average shell thickness, as well as the cavity inside the shell were investigated. In order to check the mechanical robustness and the rupturability of the HGBs, micro-compression tests of single HGB were conducted to measure their mechanical responses, which reveal the relatively high compressive strength and brittle feature. A new type of self-healing epoxy was developed based on the dual HGB carriers and the self-healing performance was optimized systematically to obtain better healing behavior. It is found the highest healing efficiency of about 62% was achieved at 50 °C for 24 h when 12.5 - 15.0 wt% healing agent carriers was incorporated at the optimized ratio of 4 : 1 for epoxy loaded HGBs (HGB-E) to amine loaded HGBs (HGB-A). It is also found that the healing efficiency increased with increased healing duration at 50 °C. In addition, the fracture toughness is improved and the tensile modulus keeps constant while the tensile strength is deteriorated by the incorporation of the carriers. ASTAR (Agency for Sci., Tech. and Research, S’pore) Accepted version 2014-08-04T01:14:26Z 2019-12-06T21:35:56Z 2014-08-04T01:14:26Z 2019-12-06T21:35:56Z 2014 2014 Journal Article Zhang, H., Wang, P., & Yang, J. (2014). Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles. Composites Science and Technology, 94, 23-29. 0266-3538 https://hdl.handle.net/10356/104595 http://hdl.handle.net/10220/20262 10.1016/j.compscitech.2014.01.009 en Composites science and technology © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Composites Science and Technology, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.compscitech.2014.01.009] application/pdf |
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DRNTU::Engineering::Aeronautical engineering::Aerodynamics Zhang, He Wang, Pengfei Yang, Jinglei Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
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Etched hollow glass bubbles (HGBs) with through-holes at micron level were used as micro-containers for epoxy and amine solution to realize the self-healing functionality in epoxy matrix. The average diameter, the average shell thickness, as well as the cavity inside the shell were investigated. In order to check the mechanical robustness and the rupturability of the HGBs, micro-compression tests of single HGB were conducted to measure their mechanical responses, which reveal the relatively high compressive strength and brittle feature. A new type of self-healing epoxy was developed based on the dual HGB carriers and the self-healing performance was optimized systematically to obtain better healing behavior. It is found the highest healing efficiency of about 62% was achieved at 50 °C for 24 h when 12.5 - 15.0 wt% healing agent carriers was incorporated at the optimized ratio of 4 : 1 for epoxy loaded HGBs (HGB-E) to amine loaded HGBs (HGB-A). It is also found that the healing efficiency increased with increased healing duration at 50 °C. In addition, the fracture toughness is improved and the tensile modulus keeps constant while the tensile strength is deteriorated by the incorporation of the carriers. |
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School of Mechanical and Aerospace Engineering |
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School of Mechanical and Aerospace Engineering Zhang, He Wang, Pengfei Yang, Jinglei |
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Article |
author |
Zhang, He Wang, Pengfei Yang, Jinglei |
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Zhang, He |
title |
Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
title_short |
Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
title_full |
Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
title_fullStr |
Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
title_full_unstemmed |
Self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
title_sort |
self-healing epoxy via epoxy–amine chemistry in dual hollow glass bubbles |
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2014 |
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https://hdl.handle.net/10356/104595 http://hdl.handle.net/10220/20262 |
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1759857426294636544 |