Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft

This study investigates the heat transfer performance of finned and pin-fin heat sinks for high power density converter in future aircraft. There is a lack of studies evaluating the cooling performance of pin-fin as compared to the finned heat sink configuration. The influence of the aspects such as...

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Main Authors: Sakanova, Assel, Tseng, King Jet
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2019
Subjects:
Online Access:https://hdl.handle.net/10356/105177
http://hdl.handle.net/10220/47881
http://dx.doi.org/10.1016/j.applthermaleng.2018.03.020
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1051772019-12-10T14:06:12Z Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft Sakanova, Assel Tseng, King Jet School of Electrical and Electronic Engineering Rolls-Royce@NTU Corporate Lab Perforated Pin Computational Fluid Dynamics DRNTU::Engineering::Electrical and electronic engineering This study investigates the heat transfer performance of finned and pin-fin heat sinks for high power density converter in future aircraft. There is a lack of studies evaluating the cooling performance of pin-fin as compared to the finned heat sink configuration. The influence of the aspects such as type of fluid flow (laminar or turbulent), type of working fluid (fuel or air) and geometry configuration (pin-fin or finned shaped heat sink) on heat transfer performance is compared. Circular, cone and hydrofoil pin fin arrays are considered. It is concluded that the thermal performance of pin-fin heat sink is superior to the finned configuration by 1.6-2 times in all cases except when fuel coolant is employed at turbulent flow. As weight of heat sink is concerned, the use of pin-fin shape can reduce half the weight of heat sink. The results of this paper are the guidance which can be applied while designing the heat sink for power electronics in future aircraft. NRF (Natl Research Foundation, S’pore) Accepted version 2019-03-21T07:25:36Z 2019-12-06T21:47:09Z 2019-03-21T07:25:36Z 2019-12-06T21:47:09Z 2018 Journal Article Sakanova, A., & Tseng, K. J. (2017). Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft. Applied Thermal Engineering, 136, 364-374. doi:10.1016/j.applthermaleng.2018.03.020 1359-4311 https://hdl.handle.net/10356/105177 http://hdl.handle.net/10220/47881 http://dx.doi.org/10.1016/j.applthermaleng.2018.03.020 en Applied Thermal Engineering © 2017 Elsevier Ltd. All rights reserved. This paper was published in Applied Thermal Engineering and is made available with permission of Elsevier Ltd. 20 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Perforated Pin
Computational Fluid Dynamics
DRNTU::Engineering::Electrical and electronic engineering
spellingShingle Perforated Pin
Computational Fluid Dynamics
DRNTU::Engineering::Electrical and electronic engineering
Sakanova, Assel
Tseng, King Jet
Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
description This study investigates the heat transfer performance of finned and pin-fin heat sinks for high power density converter in future aircraft. There is a lack of studies evaluating the cooling performance of pin-fin as compared to the finned heat sink configuration. The influence of the aspects such as type of fluid flow (laminar or turbulent), type of working fluid (fuel or air) and geometry configuration (pin-fin or finned shaped heat sink) on heat transfer performance is compared. Circular, cone and hydrofoil pin fin arrays are considered. It is concluded that the thermal performance of pin-fin heat sink is superior to the finned configuration by 1.6-2 times in all cases except when fuel coolant is employed at turbulent flow. As weight of heat sink is concerned, the use of pin-fin shape can reduce half the weight of heat sink. The results of this paper are the guidance which can be applied while designing the heat sink for power electronics in future aircraft.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Sakanova, Assel
Tseng, King Jet
format Article
author Sakanova, Assel
Tseng, King Jet
author_sort Sakanova, Assel
title Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
title_short Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
title_full Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
title_fullStr Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
title_full_unstemmed Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
title_sort comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
publishDate 2019
url https://hdl.handle.net/10356/105177
http://hdl.handle.net/10220/47881
http://dx.doi.org/10.1016/j.applthermaleng.2018.03.020
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