Study of heat transfer enhancement surfaces generated by additive manufacturing techniques

Thermal management in electronic devices is becoming increasingly challenging due to the higher heat outputs from the increased packing density of transistors. Nucleate boiling has been shown to be an effective cooling scheme for high heat flux removal. In recent years, the use of commercial porous...

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Bibliographic Details
Main Author: Wong, Kin Keong
Other Authors: Leong Kai Choong
Format: Theses and Dissertations
Language:English
Published: 2019
Subjects:
Online Access:https://hdl.handle.net/10356/105249
http://hdl.handle.net/10220/47827
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Institution: Nanyang Technological University
Language: English

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