Thermal flow sensor for ultra-low velocities based on printed circuit board technology

• المؤلفون الرئيسيون: Nguyen, N T, Huang, X Y, Toh, K C
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Aeronautical engineering::Aerodynamics
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/106164; http://hdl.handle.net/10220/23963; http://dx.doi.org/10.1088/0957-0233/12/12/314

This paper presents a new thermal flow sensor for ultra-low velocities. The sensor was fabricated with the standard printed circuit board (PCB) technology. The technology and the simple sensor design would reduce costs in fabrication and packaging. A one-dimensional analytical model is presented in...