Ng, S. W., & Yi, S. (2008). A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing.
استشهاد بنمط شيكاغوNg, Shioo Wat., و Sung Yi. A Finite Element Study of Stresses Developed in Plastic Encapsulated Electronic Packages During Leadframe Pull-out Testing. 2008.
MLA استشهادNg, Shioo Wat., و Sung Yi. A Finite Element Study of Stresses Developed in Plastic Encapsulated Electronic Packages During Leadframe Pull-out Testing. 2008.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.