APA引文

Ng, S. W., & Yi, S. (2008). A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing.

Chicago Style Citation

Ng, Shioo Wat., and Sung Yi. A Finite Element Study of Stresses Developed in Plastic Encapsulated Electronic Packages During Leadframe Pull-out Testing. 2008.

MLA引文

Ng, Shioo Wat., and Sung Yi. A Finite Element Study of Stresses Developed in Plastic Encapsulated Electronic Packages During Leadframe Pull-out Testing. 2008.

警告：這些引文格式不一定是100％准確.