APA Citation

See Toh, C. W., & Pang, J. H. L. (2008). Thermal stress analysis of electronic packaging components.

Chicago Style Citation

See Toh, Chee Wai., and John Hock Lye Pang. Thermal Stress Analysis of Electronic Packaging Components. 2008.

MLA Citation

See Toh, Chee Wai., and John Hock Lye Pang. Thermal Stress Analysis of Electronic Packaging Components. 2008.

Warning: These citations may not always be 100% accurate.