APA引文

See Toh, C. W., & Pang, J. H. L. (2008). Thermal stress analysis of electronic packaging components.

Chicago Style Citation

See Toh, Chee Wai., and John Hock Lye Pang. Thermal Stress Analysis of Electronic Packaging Components. 2008.

MLA引文

See Toh, Chee Wai., and John Hock Lye Pang. Thermal Stress Analysis of Electronic Packaging Components. 2008.

警告：這些引文格式不一定是100％准確.