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  ______    ______    _____      ___              
 /_   _//  /_   _//  /  ___||   / _ \\    ____    
   | ||     -| ||-  | // __    / //\ \\  |    \\  
  _| ||     _| ||_  | \\_\ || |  ___  || | [] ||  
 /__//     /_____//  \____//  |_||  |_|| |  __//  
 `--`      `-----`    `---`   `-`   `-`  |_|`-`   
                                         `-`

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發送短信 : Thermal stress analysis of electronic packaging components