發送短信 : Thermal stress analysis of electronic packaging components

  _____    _    _      _____   __   __   _____    
 |__  //  | || | ||   / ___//  \ \\/ // |  __ \\  
   / //   | || | ||   \___ \\   \ ` //  | |  \ || 
  / //__  | \\_/ ||   /    //    | ||   | |__/ || 
 /_____||  \____//   /____//     |_||   |_____//  
 `-----`    `---`   `-----`      `-`'    -----`