Analysis of temperature profile on a PCB in the preheat section of a wave soldering process

Analysis of temperature profile on a PCB in the preheat section of a wave soldering process

In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, p...

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Main Author: Hoe, Swee Long.
Other Authors: Toh, Kok Chuan
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Product engineering
Online Access:http://hdl.handle.net/10356/13489
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Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-13489
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spelling sg-ntu-dr.10356-134892023-03-11T17:29:12Z Analysis of temperature profile on a PCB in the preheat section of a wave soldering process Hoe, Swee Long. Toh, Kok Chuan School of Mechanical and Production Engineering Chan, Weng Kong DRNTU::Engineering::Manufacturing::Product engineering In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control. Master of Engineering (MPE) 2008-10-20T08:20:45Z 2008-10-20T08:20:45Z 1998 1998 Thesis http://hdl.handle.net/10356/13489 en 150 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Manufacturing::Product engineering
spellingShingle DRNTU::Engineering::Manufacturing::Product engineering
Hoe, Swee Long.
Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
description In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat section of a wave soldering machine is essential for good solderability, quality and product reliability. A proper preheat to PCB and electronic components will eliminate defects due to thermal shock, poor soldering joints and unreliable leads connection. In practice, this proper preheat profile is achieved through a time consuming trial-and-error method and years of experience in wave soldering process control.
author2 Toh, Kok Chuan
author_facet Toh, Kok Chuan
Hoe, Swee Long.
format Theses and Dissertations
author Hoe, Swee Long.
author_sort Hoe, Swee Long.
title Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
title_short Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
title_full Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
title_fullStr Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
title_full_unstemmed Analysis of temperature profile on a PCB in the preheat section of a wave soldering process
title_sort analysis of temperature profile on a pcb in the preheat section of a wave soldering process
publishDate 2008
url http://hdl.handle.net/10356/13489
_version_ 1761781540700815360

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