Quantitative analysis of the mechanical and electrical properties of Cu-Cu bonds for three-dimensional integrated circuits (3D ICs)

• Main Author: Leong, Hoi Liong
• Other Authors: Pey Kin Leong
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• Online Access: https://hdl.handle.net/10356/13607
• Institution: Nanyang Technological University

The increasing complexity and the scaling down of feature sizes for devices have led to the increasing dominance of interconnect delays in determining integrated circuit performance. One promising solution is to stack devices vertically, commonly known as 3D ICs. Copper is an attractive candidate fo...