Soldering defect detection in automatic optical inspection

• Main Authors: Dai, Wenting, Abdul Mujeeb, Erdt, Marius, Sourin, Alexei
• Other Authors: School of Computer Science and Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Computer science and engineering; Automated Manufacturing Systems; Automatic Optical Inspection (AOI)
• Online Access: https://hdl.handle.net/10356/137981
• Institution: Nanyang Technological University

This paper proposes an integrated detection framework of solder joint defects in the context of Automatic Optical Inspection (AOI) of Printed Circuit Boards (PCBs). Both localization and classifications tasks were considered. For the localization part, in contrast to the existing methods that are hi...