Soldering defect detection in automatic optical inspection

This paper proposes an integrated detection framework of solder joint defects in the context of Automatic Optical Inspection (AOI) of Printed Circuit Boards (PCBs). Both localization and classifications tasks were considered. For the localization part, in contrast to the existing methods that are hi...

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Main Authors: Dai, Wenting, Abdul Mujeeb, Erdt, Marius, Sourin, Alexei
其他作者: School of Computer Science and Engineering
格式: Article
語言:English
出版: 2020
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在線閱讀:https://hdl.handle.net/10356/137981
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