Soldering defect detection in automatic optical inspection

• المؤلفون الرئيسيون: Dai, Wenting, Abdul Mujeeb, Erdt, Marius, Sourin, Alexei
• مؤلفون آخرون: School of Computer Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Computer science and engineering; Automated Manufacturing Systems; Automatic Optical Inspection (AOI)
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/137981

This paper proposes an integrated detection framework of solder joint defects in the context of Automatic Optical Inspection (AOI) of Printed Circuit Boards (PCBs). Both localization and classifications tasks were considered. For the localization part, in contrast to the existing methods that are hi...