Optimizing the nanoimprinting process of copper

• Main Author: Yeo, Kai Cheng
• Other Authors: Hong Li
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2020
• Subjects: Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/139288
• Institution: Nanyang Technological University

Due to the versatility of nanowires, fabrication processes have been widely researched on. There are many protocols available for the fabrication of nanowires, but most require long hours and high cost. Ultrasonic embossing is the fabrication technique used for the purpose of this project. It exploi...