Synergistic integrated design of an electrochemical mechanical polishing end-effector for robotic polishing applications

• المؤلفون الرئيسيون: Abd El Khalick Mohammad, Hong, Jie, Wang, Danwei, Guan, Yisheng
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Electrical and electronic engineering; Robotic Polishing; Electrochemical Mechanical Polishing
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/141461
• المؤسسة: Nanyang Technological University

In this paper, we present a novel design of a robotic electrochemical mechanical polishing (ECMP) process. Firstly, the process is presented to replace the conventional ECMP process by a robotic-based one. The advantage of using industrial robots lies in their flexibility, reconfigurability, large w...