Packaging & instrumentation data acquisition

This project aims to set up and develop a comprehensive methodology of testing and quantifying the Seebeck Coefficient of samples of various physical compositions. This sub-project focuses on the physical components of said project such as the sample holder, sensor holder and integrated testing plat...

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Main Author: Ng, Jun Tian
Other Authors: Hong Li
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2020
Subjects:
Online Access:https://hdl.handle.net/10356/141527
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1415272023-03-04T18:47:43Z Packaging & instrumentation data acquisition Ng, Jun Tian Hong Li School of Mechanical and Aerospace Engineering ehongli@ntu.edu.sg Engineering::Mechanical engineering This project aims to set up and develop a comprehensive methodology of testing and quantifying the Seebeck Coefficient of samples of various physical compositions. This sub-project focuses on the physical components of said project such as the sample holder, sensor holder and integrated testing platform. This sub-project addresses the thought process behind the testing platform as well as the CAD drawing followed by the manufacturing process of the components. The fabricated parts were tested as individual components followed by an entire system. The fabricated parts underwent testing to justify their physical properties as well as to meet the requirements of the overall project. Various materials were tested in the multiple iterations of the components to arrive at the best suited materials for the task at hand. The overall project had tests conducted to conclude that the relevant data were able to be retrieved to calculate the Seebeck Coefficient of the supplied testing sample with varying accuracy. The temperature control was also found to be enough to maintain the required temperature for testing across a range of temperature. Finally, the limitations and recommendations for future usage and improvements of this project were discussed. Bachelor of Engineering (Mechanical Engineering) 2020-06-09T03:06:21Z 2020-06-09T03:06:21Z 2020 Final Year Project (FYP) https://hdl.handle.net/10356/141527 en IDFYP/19/012/5 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Ng, Jun Tian
Packaging & instrumentation data acquisition
description This project aims to set up and develop a comprehensive methodology of testing and quantifying the Seebeck Coefficient of samples of various physical compositions. This sub-project focuses on the physical components of said project such as the sample holder, sensor holder and integrated testing platform. This sub-project addresses the thought process behind the testing platform as well as the CAD drawing followed by the manufacturing process of the components. The fabricated parts were tested as individual components followed by an entire system. The fabricated parts underwent testing to justify their physical properties as well as to meet the requirements of the overall project. Various materials were tested in the multiple iterations of the components to arrive at the best suited materials for the task at hand. The overall project had tests conducted to conclude that the relevant data were able to be retrieved to calculate the Seebeck Coefficient of the supplied testing sample with varying accuracy. The temperature control was also found to be enough to maintain the required temperature for testing across a range of temperature. Finally, the limitations and recommendations for future usage and improvements of this project were discussed.
author2 Hong Li
author_facet Hong Li
Ng, Jun Tian
format Final Year Project
author Ng, Jun Tian
author_sort Ng, Jun Tian
title Packaging & instrumentation data acquisition
title_short Packaging & instrumentation data acquisition
title_full Packaging & instrumentation data acquisition
title_fullStr Packaging & instrumentation data acquisition
title_full_unstemmed Packaging & instrumentation data acquisition
title_sort packaging & instrumentation data acquisition
publisher Nanyang Technological University
publishDate 2020
url https://hdl.handle.net/10356/141527
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