Boundary element analysis of interactions of a bi-material interface crack with inclusions

This project will investigate the interactions between a circular hole/inclusion and an interface crack in a bi-material plate with negligible thickness (plane stress condition) subjected to remote uniaxial tensile stresses. Stresses acting in the perpendicular direction are considered only. A...

Full description

Saved in:
Bibliographic Details
Main Author: Niew, Kheng Peng
Other Authors: Ang Hock Eng
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2020
Subjects:
Online Access:https://hdl.handle.net/10356/142056
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Description
Summary:This project will investigate the interactions between a circular hole/inclusion and an interface crack in a bi-material plate with negligible thickness (plane stress condition) subjected to remote uniaxial tensile stresses. Stresses acting in the perpendicular direction are considered only. An analysis on the stress intensity factors (SIF) at the crack tips is performed using the Boundary Element Method (BEM) in the multi-domain context. Quadratic quarter-point crack tip elements are employed as a solution to stress singularities. It is believed that the interaction can have significant influences on the SIF at the crack tips, with either enhancement or shielding effects. The extent of influence varies depending on parameters such as relative location of the circular hole/inclusion, its geometry and the relative elastic properties of the bi-material plate.