Effect of TaN intermediate layer on the back contact reaction of sputter-deposited Cu poor Cu2ZnSnS4 and Mo

• المؤلفون الرئيسيون: Zhuk, Siarhei, Wong, Terence Kin Shun, Tyukalova, Elizaveta, Guchhait, Asim, Seng, Debbie Hwee Leng, Tripathy, Sudhiranjan, Wong, Ten It, Sharma, Mohit, Medina, Henry, Duchamp, Martial, Wong, Lydia Helena, Dalapati, Goutam Kumar
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2020
• الموضوعات: Engineering::Materials; Sputter-grown Cu2ZnSnS4; Interface Engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/142186

Ultrathin tantalum nitride (TaN) intermediate layers (IL) with thickness from 3 nm to 12 nm have been used to limit the undesirable interfacial reaction between molybdenum (Mo) and copper-zinc-tin-sulphide (CZTS). The morphology, chemical and structural properties of the samples were characterized b...