Modeling temperature and residual stress fields in selective laser melting

The paper investigates the temperature and residual stress fields in the selective laser melting (SLM) process. A three-dimensional thermo-mechanical coupling model is developed to simulate a multi-track multi-layer SLM process using the finite element method. The model considers the temperature-dep...

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Main Authors: Li, Yingli, Zhou, Kun, Tan, Pengfei, Tor, Shu Beng, Chua, Chee Kai, Leong, Kah Fai
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2020
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Online Access:https://hdl.handle.net/10356/142593
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1425932020-06-25T03:29:15Z Modeling temperature and residual stress fields in selective laser melting Li, Yingli Zhou, Kun Tan, Pengfei Tor, Shu Beng Chua, Chee Kai Leong, Kah Fai School of Mechanical and Aerospace Engineering Singapore Centre for 3D Printing Engineering::Mechanical engineering 3D Printing Selective Laser Melting The paper investigates the temperature and residual stress fields in the selective laser melting (SLM) process. A three-dimensional thermo-mechanical coupling model is developed to simulate a multi-track multi-layer SLM process using the finite element method. The model considers the temperature-dependent material properties which consist of thermal conductivity, density, enthalpy, yield stress, thermal expansion coefficient and Young's modulus. The simulated process includes the heating, melting, vaporization, solidification, shrinkage and cooling phenomena in the powder bed. The SLM scanning laser beam can be described as a moving volumetric heat source that is able to penetrate through the powder layers. The modeling results show that the residual stress component of the built part in the direction of the layer height increases with the number of the printed layers. It is found that at a given point, the residual stress component in the scanning direction is generally larger than the other two components, and the maximum von Mises stress occurs in the middle plane of the printed part. The temperature evolution and residual stress distribution predicted by the model can serve to provide guidance for SLM process parameter optimization. NRF (Natl Research Foundation, S’pore) 2020-06-25T03:29:15Z 2020-06-25T03:29:15Z 2018 Journal Article Li, Y., Zhou, K., Tan, P., Tor, S. B., Chua, C. K., & Leong, K. F. (2018). Modeling temperature and residual stress fields in selective laser melting. International Journal of Mechanical Sciences, 136, 24-35. doi:10.1016/j.ijmecsci.2017.12.001 0020-7403 https://hdl.handle.net/10356/142593 10.1016/j.ijmecsci.2017.12.001 2-s2.0-85038008616 136 24 35 en International Journal of Mechanical Sciences © 2017 Elsevier Ltd. All rights reserved.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Engineering::Mechanical engineering
3D Printing
Selective Laser Melting
spellingShingle Engineering::Mechanical engineering
3D Printing
Selective Laser Melting
Li, Yingli
Zhou, Kun
Tan, Pengfei
Tor, Shu Beng
Chua, Chee Kai
Leong, Kah Fai
Modeling temperature and residual stress fields in selective laser melting
description The paper investigates the temperature and residual stress fields in the selective laser melting (SLM) process. A three-dimensional thermo-mechanical coupling model is developed to simulate a multi-track multi-layer SLM process using the finite element method. The model considers the temperature-dependent material properties which consist of thermal conductivity, density, enthalpy, yield stress, thermal expansion coefficient and Young's modulus. The simulated process includes the heating, melting, vaporization, solidification, shrinkage and cooling phenomena in the powder bed. The SLM scanning laser beam can be described as a moving volumetric heat source that is able to penetrate through the powder layers. The modeling results show that the residual stress component of the built part in the direction of the layer height increases with the number of the printed layers. It is found that at a given point, the residual stress component in the scanning direction is generally larger than the other two components, and the maximum von Mises stress occurs in the middle plane of the printed part. The temperature evolution and residual stress distribution predicted by the model can serve to provide guidance for SLM process parameter optimization.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Li, Yingli
Zhou, Kun
Tan, Pengfei
Tor, Shu Beng
Chua, Chee Kai
Leong, Kah Fai
format Article
author Li, Yingli
Zhou, Kun
Tan, Pengfei
Tor, Shu Beng
Chua, Chee Kai
Leong, Kah Fai
author_sort Li, Yingli
title Modeling temperature and residual stress fields in selective laser melting
title_short Modeling temperature and residual stress fields in selective laser melting
title_full Modeling temperature and residual stress fields in selective laser melting
title_fullStr Modeling temperature and residual stress fields in selective laser melting
title_full_unstemmed Modeling temperature and residual stress fields in selective laser melting
title_sort modeling temperature and residual stress fields in selective laser melting
publishDate 2020
url https://hdl.handle.net/10356/142593
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