Magnetocuring of temperature failsafe epoxy adhesives

• Main Authors: Chaudhary, Richa, Chaudhary, Varun, Ramanujan, Raju V., Steele, Terry W. J.
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Materials::Composite materials; Engineering::Materials::Magnetic materials; Magnetocuring; Curie Nanoparticles
• Online Access: https://hdl.handle.net/10356/144222
• Institution: Nanyang Technological University

Adhesive technology is of high and increasing interest in a wide variety of conventional and emerging applications. One-component adhesives typically cure using moisture, heat and light. These approaches limit applications to specific substrates, inefficient handling in manufacturing, and can only b...