Induction transient liquid phase bonding of Inconel 718 with the nickel-based sintered brazing preform

• Main Authors: Yan, Guangxu, Nagarajan, Balasubramanian, Bhowmik, Ayan, Tan, Sung Chyn, Xu, Ray, Tan, Ming Jen
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2021
• 主題: Engineering::Mechanical engineering; Induction Transient Liquid Phase Bonding; Microstructure and Mechanical Properties
• 在線閱讀: https://hdl.handle.net/10356/150579

Generally, transient liquid phase (TLP) bonding is conducted with an overdose of filler metal in a vacuum furnace that necessitates excessive post machining. Recently, a new form of filler metal, the sintered brazing preforms (SBP) has been introduced to achieve a neat TLP bonding joint, which under...