Particle size reduction using ultrasonic embossing

Two-dimensional MXenes, have recently gained tremendous interest due to their excellent electrical, mechanical, electrochemical and structural properties which are excellent for use in diverse applications such as energy storage, optical and nanotechnology applications. Furthermore, MXenes’ intrinsi...

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Main Author: Shuek, Ezra Jin Hao
Other Authors: Hong Li
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2021
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Online Access:https://hdl.handle.net/10356/150890
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1508902021-06-04T01:40:13Z Particle size reduction using ultrasonic embossing Shuek, Ezra Jin Hao Hong Li School of Mechanical and Aerospace Engineering ehongli@ntu.edu.sg Engineering::Mechanical engineering Two-dimensional MXenes, have recently gained tremendous interest due to their excellent electrical, mechanical, electrochemical and structural properties which are excellent for use in diverse applications such as energy storage, optical and nanotechnology applications. Furthermore, MXenes’ intrinsic properties can be tuned to match a specific application when its particles are in the nanoscale which can be achieved by using mechanical processing techniques to reduce its particle size. Herein, the author explores a novel ultrasonic embossing technique that imprints nanostructures on MXene films. A variation of ultrasonic embossing parameters and sample preparation steps were attempted to fabricate a high yield of homogeneous MXene nanoparticles via the imprinted nanostructures. The results show that embossing with a higher amplitude (%) and etching with NaOH thereafter will lead to a higher chance of imprinting nanostructures, with an amplitude of 20% imprinting an array of nanostructures with a diameter of 200 nm. Therefore, it shows that ultrasonic embossing is suitable for fabricating MXene nanoparticles to tune its properties to a specific application. Bachelor of Engineering (Mechanical Engineering) 2021-06-04T01:40:13Z 2021-06-04T01:40:13Z 2021 Final Year Project (FYP) Shuek, J. H. E. (2021). Particle size reduction using ultrasonic embossing. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/150890 https://hdl.handle.net/10356/150890 en application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Shuek, Ezra Jin Hao
Particle size reduction using ultrasonic embossing
description Two-dimensional MXenes, have recently gained tremendous interest due to their excellent electrical, mechanical, electrochemical and structural properties which are excellent for use in diverse applications such as energy storage, optical and nanotechnology applications. Furthermore, MXenes’ intrinsic properties can be tuned to match a specific application when its particles are in the nanoscale which can be achieved by using mechanical processing techniques to reduce its particle size. Herein, the author explores a novel ultrasonic embossing technique that imprints nanostructures on MXene films. A variation of ultrasonic embossing parameters and sample preparation steps were attempted to fabricate a high yield of homogeneous MXene nanoparticles via the imprinted nanostructures. The results show that embossing with a higher amplitude (%) and etching with NaOH thereafter will lead to a higher chance of imprinting nanostructures, with an amplitude of 20% imprinting an array of nanostructures with a diameter of 200 nm. Therefore, it shows that ultrasonic embossing is suitable for fabricating MXene nanoparticles to tune its properties to a specific application.
author2 Hong Li
author_facet Hong Li
Shuek, Ezra Jin Hao
format Final Year Project
author Shuek, Ezra Jin Hao
author_sort Shuek, Ezra Jin Hao
title Particle size reduction using ultrasonic embossing
title_short Particle size reduction using ultrasonic embossing
title_full Particle size reduction using ultrasonic embossing
title_fullStr Particle size reduction using ultrasonic embossing
title_full_unstemmed Particle size reduction using ultrasonic embossing
title_sort particle size reduction using ultrasonic embossing
publisher Nanyang Technological University
publishDate 2021
url https://hdl.handle.net/10356/150890
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