Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics

• Main Authors: Chen, Biqiang, Chen, Zhong, Du, Zehui, Zhang, Guifeng
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Materials; Copper; Dissolution
• Online Access: https://hdl.handle.net/10356/151487
• Institution: Nanyang Technological University

A novel lead-free foil (AlMgGaLi) with a melting point of 398.3 ~ 414.8 °C was developed for active soldering of copper to aluminum matrix composite. The effect of joining pressure on the microstructure, interface wetting and shear strength of the dissimilar joints was analyzed. When the joining pre...