Effect of loading fraction of three-dimensional graphene foam (3D-C) on thermal, mechanical, and shape memory properties of 3D-C/SMP composite

• Main Authors: Shivakumar, Ranjana, Leong, Fei Ni, Tsang, Siu Hon, Teo, Edwin Hang Tong
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Electrical and electronic engineering; Foam; Smart Materials
• 在線閱讀: https://hdl.handle.net/10356/157030

Here, we have studied the effect of loading fraction of 3D-graphene (3D-C) on the properties of epoxy-based shape memory polymer (SMP). 3D-C has already been proven to be an effective filler to improve the thermal conductivity, resulting in increased shape transformation efficiency of the SMP. We pr...