Machining of 2D materials by ultrasonic embossing

2D materials such as Graphene have gained an immense interest ever since its discovery in 2004. Despite it being one of the thinnest materials, its mechanical properties like high strength, stiffness and toughness makes it stands out among all the materials. Due to its attractive properties, it is u...

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Main Author: Er, Kenwealth Quan Sheng
Other Authors: Hong Li
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/158890
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1588902023-03-04T20:07:48Z Machining of 2D materials by ultrasonic embossing Er, Kenwealth Quan Sheng Hong Li School of Mechanical and Aerospace Engineering ehongli@ntu.edu.sg Engineering::Mechanical engineering 2D materials such as Graphene have gained an immense interest ever since its discovery in 2004. Despite it being one of the thinnest materials, its mechanical properties like high strength, stiffness and toughness makes it stands out among all the materials. Due to its attractive properties, it is used in many applications in the field of engineering and material science. By shrinking the size of 2D materials toward nanoscale, it will allow us to access their properties in quantum regime. Herein, the author explores a novel ultrasonic embossing method that has the capability to imprint graphene nanostructures on silver and copper substrates. A variation of preparation steps to extract graphene layers from graphite crystals and transfer it onto substrates to obtain the optimal coverage were being experimented. Numerous embossing parameters were tested to fabricate a high yield of homogenous graphene nanoparticles. The results show that embossing the tape is able to produce the highest coverage of graphene on the substrate and embossing with a higher amplitude of 23% and above is able to imprint an array of graphene nanowires. Hence, ultrasonic embossing is proven to be effective in shrinking the size of 2D materials to nanoscale. Bachelor of Engineering (Mechanical Engineering) 2022-06-07T08:48:19Z 2022-06-07T08:48:19Z 2022 Final Year Project (FYP) Er, K. Q. S. (2022). Machining of 2D materials by ultrasonic embossing. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/158890 https://hdl.handle.net/10356/158890 en A102 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Er, Kenwealth Quan Sheng
Machining of 2D materials by ultrasonic embossing
description 2D materials such as Graphene have gained an immense interest ever since its discovery in 2004. Despite it being one of the thinnest materials, its mechanical properties like high strength, stiffness and toughness makes it stands out among all the materials. Due to its attractive properties, it is used in many applications in the field of engineering and material science. By shrinking the size of 2D materials toward nanoscale, it will allow us to access their properties in quantum regime. Herein, the author explores a novel ultrasonic embossing method that has the capability to imprint graphene nanostructures on silver and copper substrates. A variation of preparation steps to extract graphene layers from graphite crystals and transfer it onto substrates to obtain the optimal coverage were being experimented. Numerous embossing parameters were tested to fabricate a high yield of homogenous graphene nanoparticles. The results show that embossing the tape is able to produce the highest coverage of graphene on the substrate and embossing with a higher amplitude of 23% and above is able to imprint an array of graphene nanowires. Hence, ultrasonic embossing is proven to be effective in shrinking the size of 2D materials to nanoscale.
author2 Hong Li
author_facet Hong Li
Er, Kenwealth Quan Sheng
format Final Year Project
author Er, Kenwealth Quan Sheng
author_sort Er, Kenwealth Quan Sheng
title Machining of 2D materials by ultrasonic embossing
title_short Machining of 2D materials by ultrasonic embossing
title_full Machining of 2D materials by ultrasonic embossing
title_fullStr Machining of 2D materials by ultrasonic embossing
title_full_unstemmed Machining of 2D materials by ultrasonic embossing
title_sort machining of 2d materials by ultrasonic embossing
publisher Nanyang Technological University
publishDate 2022
url https://hdl.handle.net/10356/158890
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