Submerged impingement cooling for the high thermal flux electric board
To meet the demand for rapid heat removal for high-powered electronic devices, submerged impingement cooling has been shown to be a viable way for the removal of high heat flux. The present study will investigate the effects of varying jet outflow nozzle hole count, volumetric flow rate along with d...
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| Format: | Final Year Project |
| Language: | English |
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Nanyang Technological University
2022
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| Online Access: | https://hdl.handle.net/10356/159119 |
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| Institution: | Nanyang Technological University |
| Language: | English |
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