Electrowetting effect on boiling point
Over the years, there are studies that shows how electrowetting (EW) can improve the boiling performance by comparing to hydrophobic surfaces. In EW, voltage plays a huge part in the process. The contact angle of droplets will decrease as the voltage is increase. There is not much to say how the l...
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Format: | Final Year Project |
Language: | English |
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Nanyang Technological University
2022
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Online Access: | https://hdl.handle.net/10356/159124 |
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Institution: | Nanyang Technological University |
Language: | English |
Summary: | Over the years, there are studies that shows how electrowetting (EW) can improve the boiling performance by comparing to hydrophobic surfaces. In EW, voltage plays a huge part in the
process. The contact angle of droplets will decrease as the voltage is increase. There is not
much to say how the level of voltage can have an influence on boiling heat transfer
parameters: boiling heat transfer coefficient (BHTC) and critical heat flux (CHF).
This report will focus on the study of enhancing boiling heat transfer using EW with various
level of voltage. The first part of the report will cover the fundamentals of pool boiling and
heat transfer characteristics of the various boiling regimes. There will also be detailed
explanation on the principle of wettability and studies on pool boiling enhancement through
EW.
Thereafter, the assembly and procedures of the experimental setup will be further elaborated
with the help of simple diagram and actual photos. A setting where no voltage is applied to
the experiment set up will also be included. The readings obtain in that setting will be used to
compare with the various high level of voltage, to see the effects it has on the boiling heat
transfer performance. Proper analyses were done on the collected data which includes CHF,
minimum heat flux and surface temperature.
Finally, it was concluded that through the experiments conducted on the various level of
voltage, it was found that the higher level of voltage helps optimize the boiling heat transfer
performance. Thus, this can help with further improvement on existing EW application, such
as electronic chips and microprocessors. |
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