First-principles study of the anisotropic thermal expansion and thermal transport properties in h-BN

• Main Authors: Niu, Bo, Zhong, Lixiang, Hao, Wei, Yang, Zhihua, Duan, Xiaoming, Cai, Delong, He, Peigang, Jia, Dechang, Li, Shuzhou, Zhou, Yu
• 其他作者: School of Materials Science and Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Materials; Thermal Expansion Coefficient; Thermal Conductivity
• 在線閱讀: https://hdl.handle.net/10356/159983
• 機構: Nanyang Technological University

The thermal expansion coefficient (TEC) and thermal conductivity (k) of thermal fillers are key factors for designing thermal management and thermal protection composite materials. Due to its unique advantages, hexagonal boron nitride (h-BN) is one of the most commonly used thermal fillers. However,...